viaemail at or by phone at 886 3 280 5680

Seeing Veach make like Matt Hughes on the first slam makes me want to see Edgar win one more fight before getting a title shot, against either Tyson Griffin or Gray Maynard. Beat a guy who can dominate you on the ground and you've earned your title shot. 8. Count Me Out for Season 11 Honestly, when Dana White said, "The fans want to see them fight again" in reference to the freshly-announced coaches of The Ultimate Fighter' s 11th season Chuck Liddell and Tito Ortiz, I shook my head and asked, "What fans" I'm a fan and I have no interest in seeing a third fight between the two for a number of reasons:Liddell is up 2-0, so it's not like we need a rubber match.It does nothing for the division or the company, so I don't really care who wins.It'll be 2010 when they finally meet, also known as nearly three years since either guy won a goddamn fight.At least they're not tying up a title, but this is enough for me to officially submit my "reboot the franchise or I'm not watching anymore" statement for Dana White's consideration. 9. Things Are Getting a Little Sloppy My wife actually brought this up during the James McSweeney-Darrill Schoonover fight and I think she's right. Just in this fight alone, we saw McSweeney almost fire a big knee to his downed opponent, run his fingers over Schoonover's eyes, prompting a warning from Josh Rosenthal, and deliver an elbow after the bell to the base of the neck.

Personally, a lot of it is the fighter's themselves, the heat of the moment, and the timing of blows, but part of it, at least I think, goes to the emergence of so many organizations and the tough guy image too many people buy into because they're MMA fighters/wear Affliction gear. Respect for your opponent and the quest to prove your dominance and honor your style and team is losing ground to talking the most trash and being the toughest douche bag in the room who can't always be expected to remember the rules. While I know TNA Wrestling also broadcasts on Spike TV and using the UFC platform to push just about anything makes sense, putting Mixed Martial Arts next to Professional Wrestling doesn't sit all that well with me. Having Hulk Hogan on the broadcast accomplishes what for the sport of Mixed Martial Arts Sure it bumps the numbers for TNA a little for the next couple weeks and helps them announce their intentions to start up a new version of "The Monday Night Wars" with the WWE, but nowhere in there did I say anything about the UFC gaining anything Because they don't. Additionally, people have already and will resume talking about the pro wrestling connections should all the Shane McMahon rumors ever come to fruition and people keep referring to Brock Lesnar as a "heel" like he's playing a bad guy in the WWE. I know why they did it and the UFC certainly has to continue to shill everything under the sun for Spike TV, but just know that this left me feeling a little dirty This article is also featured on MMA Madness.

Localized Support to Address Increased Demand for 3D IC Process Development inAsia PacificST FLORIAN, Austria and ROLLA, Mo., Jan. 7 /PRNewswire/ EV Group (EVG)and Brewer Science, Inc., today announced the installation of an EVG 500series wafer-bonding system at Brewer Science's Taiwan applications lab.Located in Hsinchu Science Park, this joint effort offers customers timelylocalized support in the Asia-Pacific region for 3D IC and other advancedprocess development programs.In a shared commitment to speedcommercialization of through-silicon via (TSV) technology and enable thedevelopment of smaller, higher performance, and more power-efficientelectronic devices, this move is set to continue the momentum of their jointdevelopment efforts.In December 2007, EVG and Brewer Science announced ultra-thin waferhandling capability for TSV creation to enable 3D chip stacking.This jointdevelopment program continues efforts to provide a complete family of ultra-thin wafer handling solutions to leading-edge CMOS image sensors, DRAM, andintegrated devices manufacturers, who demand wider temperature range, thinwafer etching, passivation and metallization.To better leverage theirbonding and materials expertise and relationships in Taiwan, the two companiesnow bring local bonding capability to technology development teams for rapidprocess testing and development in the Asia-Pacific region."With Taiwan, and Asia Pacific generally, home to leading adopters ofnovel processes such as TSV, the move to jointly manage customer processdevelopment locally is a logical progression in advancing our partnershipefforts with Brewer Science," remarked Stefan Pargfrieder, EVG's businessdevelopment manager."By leveraging Brewer Science's facility and equippingthem to handle temporary bonding demonstrations, it allows us to have fastercycle times and a more centralized hands-on lab to collaborate closely toadapt the process to our Asia-Pacific customers' requirements."Pargfriederconcluded, "The addition of an applications lab in Taiwan not only augmentsour network of global demonstration centers, but also truly reinforces ourcommitment to delivering faster, localized support to our customer base."Commenting on today's news, Mark Privett, product manager of bondingmaterials at Brewer Science, Inc., added, "Demand for localized TSVdevelopment support in the Asia-Pacific region warranted this investment.Adding EVG's 500 series bonder to the laboratory in Taiwan will helpaccelerate the adoption of TSV and 3DP technology in the region.The additionof the bonder to the lab also allows us to provide process training for theregion's engineers."EVG's 500 series wafer bonding system was integrated in the applicationslab in December 2008.To formally initiate the joint efforts in Taiwan, the companies will hosta technology workshop featuring presentations by EVG and Brewer Sciencespecialists on solutions for 3D interconnects using thin-wafer handlingtechnology.This workshop, which will take place in Hsinchu, is scheduled forJanuary 15, 2009.For more details, please contact EVG Jointech Corp. viaemail at or by phone at 886 3 280 5680.About Brewer ScienceBrewer Science is a leading-edge materials supplier to the electronicsindustry and provides solutions for lithography, advanced packaging, MEMS,nanotechnology, optoelectronics and compound semiconductor applications. Ourextensive product portfolio includes ARC(R) anti-reflective coatings formicrolithography, ProTEK(R) temporary etch protective coatings, WaferBOND(TM)temporary bonding materials, Cee(R) precision coat-bake-develop equipment andmicroelectronics-grade carbon nanotube solutions.Exceptional technical expertise and extensive semiconductor industryknowledge, combined with a long tradition of addressing market and customerneeds through its world-class product and customer support, make BrewerScience an exceptional global supplier of choice.For further information please visit http:// or ut EV GroupEV Group (EVG) is a world leader in wafer-processing solutions forsemiconductor, MEMS and nanotechnology applications.Through closecollaboration with its global customers, the company implements its flexiblemanufacturing model to develop reliable, high-quality, low-cost-of-ownershipsystems that are easily integrated into customers' fab lines.Key productsinclude wafer bonding, lithography/nanoimprint lithography (NIL) and metrologyequipment, as well as photoresist coaters, cleaners and inspection systems.In addition to its dominant share of the market for wafer bonders, EVGholds a leading position in NIL and lithography for advanced packaging andMEMS.Along these lines, the company co-founded the EMC-3D consortium in 2006to create and help drive implementation of a cost-effective through-siliconvia (TSV) process for major ICs and MEMS/sensors.Other target semiconductor-related markets include silicon-on-insulator (SOI), compound semiconductor andsilicon-based power-device solutions.Founded in 1980, EVG is headquartered in St.